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A Study of Diffusion Barrier Characteristics of Electroless Co(W,P) Layers to Lead-free SnAgCu Solder
Pan, Hung-Chun, Hsieh, Tsung-EongVolume:
1156
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-1156-D03-07
Date:
January, 2009
File:
PDF, 1.71 MB
english, 2009