In Situ Displacement Measurement of Flex Package Subject to Thermal Shock Conditions
Yoon, Samson, Cho, Seung Min, Lee, Yuri, Han, Bong TaeVolume:
326-328
Year:
2006
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.326-328.525
File:
PDF, 1.02 MB
english, 2006