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Applied Mathematics and Computation 2015 / 2

Verification of a multiscale surface stress model near voids in copper under the load induced by external high electric field

Vigonski, Simon, Veske, Mihkel, Aabloo, Alvo, Djurabekova, Flyura, Zadin, Vahur
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Language:
english
Journal:
Applied Mathematics and Computation
DOI:
10.1016/j.amc.2015.01.102
Date:
February, 2015
File:
PDF, 2.39 MB
english, 2015
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