![](/img/cover-not-exists.png)
Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints
Shohji, Ikuo, Kobayashi, Tatsuya, Tohei, TomotakeVolume:
462-463
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.462-463.76
Date:
January, 2011
File:
PDF, 538 KB
english, 2011