Analysis of Stress-Strain Hysteresis Loop and Prediction of...

Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints

Shohji, Ikuo, Kobayashi, Tatsuya, Tohei, Tomotake
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Volume:
462-463
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.462-463.76
Date:
January, 2011
File:
PDF, 538 KB
english, 2011
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