![](/img/cover-not-exists.png)
The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging
Kornain, Zainudin, Jalar, Azman, Rasid, Rozaidi, Abdullah, ShahrumVolume:
462-463
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.462-463.1194
Date:
January, 2011
File:
PDF, 343 KB
english, 2011