![](/img/cover-not-exists.png)
Design and Simulation of Molded Interconnect Devices with Two Shot Molding
Zhuo, Yong, Peng, Juan, Wu, Yan JunVolume:
295-297
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.295-297.1651
Date:
July, 2011
File:
PDF, 1.34 MB
english, 2011