Computer simulation of solder paste flow Part II: Flow out...

Journal of Electronics Manufacturing 1994 / 09 Vol. 4; Iss. 3

Computer simulation of solder paste flow Part II: Flow out of a stencil aperture

MANNAN, S.H., EKERE, N.N., ISMAIL, I., CURRIE, M.A.
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Volume:
4
Journal:
Journal of Electronics Manufacturing
DOI:
10.1142/S096031319400016X
Date:
September, 1994
File:
PDF, 465 KB
1994
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