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Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects
Haase, J., Farley, D., Iyer, P., Baumgartner, P., Dasgupta, A., Caers, J. F. J.Volume:
22
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856108x320564
Date:
January, 2008
File:
PDF, 6.76 MB
english, 2008