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Void evolution and its dependence on segment length in Cu interconnects
Leon, R., Colon, J.A., Evans, K.C., Vu, D.T., Blaschke, V., Bavarian, B., Ogawa, E.T., Ho, P.S.Volume:
19
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2004.0408
Date:
November, 2004
File:
PDF, 377 KB
english, 2004