Void evolution and its dependence on segment length in Cu...

Void evolution and its dependence on segment length in Cu interconnects

Leon, R., Colon, J.A., Evans, K.C., Vu, D.T., Blaschke, V., Bavarian, B., Ogawa, E.T., Ho, P.S.
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Volume:
19
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2004.0408
Date:
November, 2004
File:
PDF, 377 KB
english, 2004
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