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Suppression of vigorous liquid Sn/Te reactions by Sn–Cu solder alloys
Liao, Chien-Neng, Lee, Ching-HuaVolume:
23
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2008.0409
Date:
December, 2008
File:
PDF, 642 KB
english, 2008