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Grain Size Analysis in Electrodeposited Cu-Coatings
Schläfer, S., Klimanek, P., Handreg, I., Heinzel, G., Lanza, G.Volume:
228-231
Year:
1996
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.228-231.457
File:
PDF, 881 KB
1996