Influence of Process Conditions of Thixomolding® on the...

Materials Science Forum 2005 Vol. 488-489

Influence of Process Conditions of Thixomolding® on the Microstructure of Magnesium Mobile Phone Housing

Cui, Xiao Peng, Liu, Yong Bing, Cao, Zhan Yi, Yang, Xiao Hong, Liang, Wei
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Volume:
488-489
Year:
2005
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.488-489.377
File:
PDF, 1.91 MB
english, 2005
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