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Novel Fabrication of Cu Interconnection by Displacing the Prepatterned Ti Film for ULSI
Yang, Chin-Hao, Yang, Wen-LuhVolume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1928170
File:
PDF, 257 KB
english, 2005