A Study on the Bonding Process of Cu Bump/Sn/Cu Bump...

Journal of The Electrochemical Society 2010 Vol. 157; Iss. 4

A Study on the Bonding Process of Cu Bump/Sn/Cu Bump Bonding Structure for 3D Packaging Applications

Lee, Byunghoon, Park, Jongseo, Jeon, Seong-jae, Kwon, Kee-won, Lee, Hoo-jeong
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Volume:
157
Year:
2010
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3301931
File:
PDF, 438 KB
english, 2010
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