A novel bottom–up copper filling of blind silicon vias in 3D electronic packaging
Du, Li, Shi, Tielin, Su, Lei, Xue, Dongmin, Liao, GuanglanVolume:
25
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/25/4/045005
Date:
April, 2015
File:
PDF, 958 KB
english, 2015