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ECS Transactions [ECS China Semiconductor Technology International Conference 2012 (CSTIC 2012) - Shanghai, China (March 18 - March 19, 2012)] - Wafer Backside Arcing Prevention in SIP Ti/TiN Process
Huang, Hupin, Lin, Paul-Chang, Gui, Kun, Wang, William, Li, Terry, Ji, Justin, Jiang, Jian-YongYear:
2012
Language:
english
DOI:
10.1149/1.3694361
File:
PDF, 150 KB
english, 2012