Effect of Pad Surface Roughness on SiO 2...

Japanese Journal of Applied Physics 2006 / 2 Vol. 45; Iss. 2A

Effect of Pad Surface Roughness on SiO 2 Removal Rate in Chemical Mechanical Polishing with Ceria Slurry

Yoshida, Masato, Ono, Hiroshi, Nishiyama, Masaya, Ashizawa, Toranosuke, Doi, Toshiro
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Volume:
45
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.45.733
Date:
February, 2006
File:
PDF, 140 KB
english, 2006
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