ECMP Enhances the Planarization Efficiency — a Phenomenon of Reverse Topography during Cu Removal
Liu, Feng Q, Hsu, Wei-Yung, Duboust, Alain, Chen, LiangVolume:
991
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-0991-C11-03
Date:
January, 2007
File:
PDF, 891 KB
english, 2007