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Cu films by partially ionized beam deposition for ultra large scale integration metallization
Kim, Ki-Hwan, Jang, Hong-Gui, Han, Sung, Jung, Hyung-Jin, Koh, Seok-Keun, Choi, Doo-JinVolume:
13
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.1998.0165
Date:
May, 1998
File:
PDF, 314 KB
english, 1998