On the Mechanism of Copper Oxide Reduction by Dielectric Barrier Discharge Plasma Using H2 and Ar Mixture Gases
Xu, Zhi Jian, Qi, Bin, Di, Lan BoVolume:
690-693
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.690-693.1664
Date:
May, 2013
File:
PDF, 349 KB
english, 2013