Bottom-Up Fill for Submicrometer Copper Via Holes of ULSIs...

Journal of The Electrochemical Society 2004 Vol. 151; Iss. 12

Bottom-Up Fill for Submicrometer Copper Via Holes of ULSIs by Electroless Plating

Wang, Zenglin, Yaegashi, Osamu, Sakaue, Hiroyuki, Takahagi, Takayuki, Shingubara, Shoso
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Volume:
151
Year:
2004
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1810453
File:
PDF, 691 KB
english, 2004
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