Formation and evolution of intermetallic compounds at...

Journal of Materials Processing Technology 2015 / 09 Vol. 223

Formation and evolution of intermetallic compounds at interfaces of Cu/Al joints by ultrasonic-assisted soldering

Huiwen, Zhang, Wei, Cui, Jingshan, He, Jiuchun, Yan, Shiqin, Yang
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Volume:
223
Language:
english
Journal:
Journal of Materials Processing Technology
DOI:
10.1016/j.jmatprotec.2015.03.019
Date:
September, 2015
File:
PDF, 1.39 MB
english, 2015
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