Adhesion of Chemical Vapor Deposited Boron Carbo-nitride to...

Journal of Materials Research 2005 / 8 Vol. 20; Iss. 8

Adhesion of Chemical Vapor Deposited Boron Carbo-nitride to Dielectric and Copper Films

Engbrecht, E.R., Fitzpatrick, P.R., Junker, K.H., Sun, Y-M., White, J.M., Ekerdt, J.G.
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Volume:
20
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2005.0279
Date:
August, 2005
File:
PDF, 307 KB
english, 2005
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