Thermal and dielectric properties and curing kinetics of...

Thermal and dielectric properties and curing kinetics of nanomaterials formed from poss-epoxy and meta-phenylenediamine

Wen-Yi Chen, Yen-Zen Wang, Shiao-Wei Kuo, Chih-Feng Huang, Pao-Hsiang Tung, Feng-Chih Chang
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Volume:
45
Year:
2004
Language:
english
Pages:
12
DOI:
10.1016/j.polymer.2004.07.070
File:
PDF, 296 KB
english, 2004
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