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Effect of molecular structures and mobility on the thermal and dynamical mechanical properties of thermally cured epoxy-bridged polyorganosiloxanes
Tzong-Ming Lee, Chen-Chi M. Ma, Chia-Wen Hsu, Han-Lang WuVolume:
46
Year:
2005
Language:
english
Pages:
11
DOI:
10.1016/j.polymer.2005.06.069
File:
PDF, 411 KB
english, 2005