Formation of intermetallic compounds at eutectic Sn–Zn–Al...

Journal of Materials Research 2001 / 1 Vol. 16; Iss. 1

Formation of intermetallic compounds at eutectic Sn–Zn–Al solder/Cu interface

Yu, Shan-Pu, Wang, Moo-Chin, Hon, Min-Hsiung
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Volume:
16
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2001.0015
Date:
January, 2001
File:
PDF, 687 KB
english, 2001
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