High Resolution Thermal Imaging of Integrated Circuits

High Resolution Thermal Imaging of Integrated Circuits

Tessier, Gilles, Bardoux, Mathieu, Filloy, Céline, Fournier, Danièle
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Volume:
1022
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-1022-II06-02
Date:
January, 2007
File:
PDF, 722 KB
english, 2007
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