Non-Destructive SiC Wafer Evaluation Based on an Optical Stress Technique
Ma, Xian Yun, Parker, Mathew, Ma, Yuefei, Kubota, T., Sudarshan, Tangali S.Volume:
433-436
Year:
2003
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.433-436.361
File:
PDF, 356 KB
english, 2003