Ceramic Micropackages Realised through the Technology....

Key Engineering Materials 1997 Vol. 132-136

Ceramic Micropackages Realised through the Technology. Specific to Electronic Components

Anton, Cornel, Burghelea, Virginia, Anton, Ioana
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
132-136
Year:
1997
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.132-136.1163
File:
PDF, 230 KB
1997
Conversion to is in progress
Conversion to is failed