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Ultrasonic bond process for polymer-based anisotropic conductive film joints. Part 2: Application in chip-on-FR4 board assemblies
Y.C. Lin, Xiao-Nan Fang, Yu-Qiang Jiang, Hao JinVolume:
30
Year:
2011
Language:
english
Pages:
8
DOI:
10.1016/j.polymertesting.2011.03.003
File:
PDF, 885 KB
english, 2011