The Analysis of Temperature Field and Residual Stress...

Advanced Materials Research 2011 / 2 Vol. 194-196

The Analysis of Temperature Field and Residual Stress Distribution during H-Beam Cooling Process

Zang, Yong, Zhang, Bo, Cui, Li Hong, Gao, Zhi Ying
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Volume:
194-196
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.194-196.20
Date:
February, 2011
File:
PDF, 929 KB
english, 2011
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