Improvement of Electromigration Lifetime of Submicrometer Dual-Damascene Cu Interconnects Through Surface Engineering
Vairagar, A. V., Gan, Zhenghao, Shao, Wei, Mhaisalkar, S. G., Li, Hongyu, Tu, K. N., Chen, Zhong, Zschech, E., Engelmann, H. J., Zhang, SamVolume:
153
Year:
2006
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2217267
File:
PDF, 575 KB
english, 2006