Copper Chemical Vapor Deposition using a Novel Cu(II) Precursor for Contact Via Filling Process
Zama, Hideaki, Nishimura, Yuuji, Yago, Michiyo, Watanabe, MikioVolume:
990
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-0990-B08-27
Date:
January, 2007
File:
PDF, 676 KB
english, 2007