Copper Chemical Vapor Deposition using a Novel Cu(II)...

Copper Chemical Vapor Deposition using a Novel Cu(II) Precursor for Contact Via Filling Process

Zama, Hideaki, Nishimura, Yuuji, Yago, Michiyo, Watanabe, Mikio
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Volume:
990
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-0990-B08-27
Date:
January, 2007
File:
PDF, 676 KB
english, 2007
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