Wafer level packaging technology for silicon resonators

Wafer level packaging technology for silicon resonators

J. Baborowski, A. Pezous, G. Spinola Durante, R. Jose James, R. Ziltener, C. Muller, M.-A. Dubois
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Volume:
1
Year:
2009
Language:
english
Pages:
4
DOI:
10.1016/j.proche.2009.07.383
File:
PDF, 508 KB
english, 2009
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