![](/img/cover-not-exists.png)
Wafer level packaging technology for silicon resonators
J. Baborowski, A. Pezous, G. Spinola Durante, R. Jose James, R. Ziltener, C. Muller, M.-A. DuboisVolume:
1
Year:
2009
Language:
english
Pages:
4
DOI:
10.1016/j.proche.2009.07.383
File:
PDF, 508 KB
english, 2009