Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects
Sinha, K., Farley, D., Kahnert, T., Solares, S.D., Dasgupta, A., Caers, J.F.J., Zhao, X.J.Volume:
28
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1080/01694243.2014.891349
Date:
June, 2014
File:
PDF, 981 KB
english, 2014