A Simulation Approach of Dishing in Chemical Mechanical...

A Simulation Approach of Dishing in Chemical Mechanical Polishing of Inlaid Copper Structures

Lin, Jia-Bin, Lin, Shih-Chieh, Hocheng, Hong
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Volume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1946467
File:
PDF, 174 KB
english, 2005
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