![](/img/cover-not-exists.png)
A Simulation Approach of Dishing in Chemical Mechanical Polishing of Inlaid Copper Structures
Lin, Jia-Bin, Lin, Shih-Chieh, Hocheng, HongVolume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1946467
File:
PDF, 174 KB
english, 2005