Modeling and Simulation of Lapping Processes Based on Grain...

Modeling and Simulation of Lapping Processes Based on Grain Size Sensitivity Model

Dai, Yong, Yuan, Ju Long, Zhou, Zhao Zhong, Zheng, Jia Jin, Zhao, Ping
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Volume:
304-305
Year:
2006
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.304-305.389
File:
PDF, 470 KB
english, 2006
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