Modeling and Simulation of Lapping Processes Based on Grain Size Sensitivity Model
Dai, Yong, Yuan, Ju Long, Zhou, Zhao Zhong, Zheng, Jia Jin, Zhao, PingVolume:
304-305
Year:
2006
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.304-305.389
File:
PDF, 470 KB
english, 2006