Design of Mold Materials for Encapsulating Semiconductors...

Materials Science Forum 2007 Vol. 561-565

Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds

Kitaoka, Satoshi, Kawashima, Naoki, Maeda, Keiji, Kuno, Takaki, Noguchi, Yoshinori
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Volume:
561-565
Year:
2007
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.561-565.539
File:
PDF, 616 KB
2007
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