Sintering of Copper Sub-Micron Particles by Heat and...

Key Engineering Materials 2013 / 12 Vol. 596

Sintering of Copper Sub-Micron Particles by Heat and Atmospheric Pressure Non-Equilibrium Plasma Treatments

Fei, Xiao Meng, Kuroda, Shinichi, Zhang, Gui Ling, Mori, Tamio, Hosoi, Katsuhiko
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Volume:
596
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.596.60
Date:
December, 2013
File:
PDF, 1.60 MB
english, 2013
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