![](/img/cover-not-exists.png)
[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Improving the thermal and mechanical properties of epoxy resins for electronic packaging
Liang, Shuang, Gui, Dayong, Zhang, Wenchuan, Xiong, Weijian, Liu, JianhongYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922634
File:
PDF, 314 KB
english, 2014