[IEEE 2014 15th International Conference on Electronic...

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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Improving the thermal and mechanical properties of epoxy resins for electronic packaging

Liang, Shuang, Gui, Dayong, Zhang, Wenchuan, Xiong, Weijian, Liu, Jianhong
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Year:
2014
Language:
english
DOI:
10.1109/icept.2014.6922634
File:
PDF, 314 KB
english, 2014
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