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The Thermal and Di-Electric Properties of a Silicone-Based Thermal Pad
Jou, Wern Shiarng, Hsu, Chih Feng, Yeh, Yu KunVolume:
295-297
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.295-297.804
Date:
July, 2011
File:
PDF, 826 KB
english, 2011