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Joining of Silicon Nitride by Interposing Metal Foils: Effects of Temperature and Bonding Pressure
Osendi, María Isabel, Miranzo, PilarVolume:
426-432
Year:
2003
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.426-432.4075
File:
PDF, 512 KB
2003