Innovative 3C-SiC on SiC via Direct Wafer Bonding

Materials Science Forum 2013 / 1 Vol. 740-742

Innovative 3C-SiC on SiC via Direct Wafer Bonding

Jennings, Michael R., Pérez-Tomás, Amador, Severino, Andrea, Ward, Peter, Bashir, Arif, Fisher, Craig, Thomas, Stephen M., Gammon, Peter M., Donnellan, Benedict T., Rong, Hua, Hamilton, D.P., Mawby, P
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Volume:
740-742
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.740-742.271
Date:
January, 2013
File:
PDF, 1.51 MB
english, 2013
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