Microstructure of SiC / TiAl Interface Formed by Solid-State Diffusion Bonding
Maeda, Masakatsu, Tenyama, Kazuyuki, Shibayanagi, Toshiya, Naka, MasaakiVolume:
502
Year:
2005
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.502.461
File:
PDF, 820 KB
english, 2005