A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct...

Journal of The Electrochemical Society 2008 Vol. 155; Iss. 8

A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu

Kim, Soo-Hyun, Kim, Hyun Tae, Yim, Sung-Soo, Lee, Do-Joong, Kim, Ki-Su, Kim, Hyun-Mi, Kim, Ki-Bum, Sohn, Hyunchul
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Volume:
155
Year:
2008
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2940447
File:
PDF, 697 KB
english, 2008
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