Thinning of SiC Wafer by Plasma Chemical Vaporization...

Materials Science Forum 2010 / 4 Vol. 645-648

Thinning of SiC Wafer by Plasma Chemical Vaporization Machining

Sano, Yasuhisa, Kato, Takehiro, Hori, Tsutomu, Yamamura, Kazuya, Mimura, Hidekazu, Katsuyama, Yoshiaki, Yamauchi, Kazuto
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Volume:
645-648
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.645-648.857
Date:
April, 2010
File:
PDF, 543 KB
english, 2010
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