Fabrication of SiCp/Cu Composite by Powder Injection Molding
Yang, Jian Ming, Li, Hua Qiang, Chen, Hua, He, Yi Qiang, Feng, Li ChaoVolume:
291-294
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.291-294.721
Date:
July, 2011
File:
PDF, 320 KB
english, 2011