Thermal Conductivities of β-Si3N4 and BN-Filled Epoxy Molding Compounds (EMC)
Yuan, Zhu, Chen, Ke XinVolume:
368-372
Year:
2008
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.368-372.1071
File:
PDF, 326 KB
english, 2008