A New Cutting Wire Prepared by Copper-Diamond Composite...

Materials Science Forum 2014 / 4 Vol. 788

A New Cutting Wire Prepared by Copper-Diamond Composite Electroplating

Wang, Zhao Yang, Zheng, Jing Wu, Cai, Wei, Qiao, Liang, Ying, Yao, Jiang, Li Qiang, Che, Sheng Lei
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
788
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.788.662
Date:
April, 2014
File:
PDF, 328 KB
english, 2014
Conversion to is in progress
Conversion to is failed