Effects of the Cooling Rate on the Solidification Microstructure of Cu-Ni Alloy
Yuan, Jia Wei, Pang, Yu Hua, Hu, Yang Lei, Sun, Qi, Liu, Dong, Yang, Yan HuiVolume:
658
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.658.444
Date:
July, 2010
File:
PDF, 1.01 MB
english, 2010